The UP Electrical and Electronics Engineering Institute led the ceremonial signing of the Memorandum of Understanding (MOU) with MTI Advanced Test Development Corporation (Microchip) yesterday, 26 June 2023 at EEE Meralco Hall (Room 120).
Present during the signing are Dr. Lew Andrew Tria, EEEI Director, together with Dr. Eric Augustus Tingatinga, Associate Dean for Alumni and Linkages representing on behalf of UP Diliman Chancellor Edgardo Carlo Vistan II and CoE Dean Maria Antonia Tanchuling, and Mr. Cristopher Balla from Microchip.
The MOU between EEEI and Microchip, valid for three years, aims to develop academic cooperation and promote mutual understanding in forms of, but not limited to, on-the-job training for students; collaborative research projects; lectures, and symposia; and exchange of academic information and materials.
After the signing, the team also took a tour of the EEE facilities and laboratories.
